Manufacturing apparatus for display device and method of using the same

ABSTRACT

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

This application is a divisional application of U.S. application Ser.No. 16/111,346 filed Aug. 24, 2018, which claims priority to KoreanPatent Application No. 10-2017-0113289 filed on Sep. 5, 2017, and allthe benefits accruing therefrom under 35 U.S.C. 119, the contents ofwhich in its entirety are herein incorporated by reference.

BACKGROUND 1. Field

The present disclosure relates to a display device, a manufacturingapparatus for a display device and a manufacturing method using themanufacturing apparatus for a display device.

2. Description of the Related Art

Display devices are increasingly important along with the development ofmultimedia. Accordingly, various types of display devices such as aliquid crystal display (“LCD”), an organic light emitting display(“OLED”) and the like are used.

Electronic devices based on mobility thereof have been widely used. Inaddition to small electronic devices such as mobile phones, tabletpersonal computers (“PCs”) are widely used as portable electronicdevices.

In order to support various functions, the portable electronic deviceincludes a display device for providing a user with visual informationsuch as an image or video. As other components for driving the displaydevice are miniaturized, a proportion of the display device in theelectronic device is gradually increasing, and a structure in which thecomponents can be deformed or bent to have a predetermined angle withina flat state of the overall display device is being developed.

SUMMARY

One or more embodiment of the present disclosure provide a manufacturingmethod of a display device, capable of reducing or effectivelypreventing damage to a printed circuit board in a manufacturing process.

Features of the present disclosure also provide a manufacturingapparatus of a display device, capable of reducing or effectivelypreventing damage to a printed circuit board in a manufacturing process.

However, features of the present disclosure are not restricted to thoseset forth herein. The above and other features of the present disclosurewill become more apparent to one of ordinary skill in the art to whichthe present disclosure pertains by referencing the detailed descriptionof the present disclosure given below.

According to an embodiment of the present disclosure, there is provideda manufacturing method of a display device, including: loading, on astage, a panel assembly including a display panel which is drivable by asignal applied thereto to display an image, and a first printed circuitboard and a second printed circuit board through which the signal istransmittable to the display panel, attached to the display panel, endportions of the first and second printed circuit boards disposedoverlapping each other; providing a jet of air to the overlapping endportion of the second printed circuit board to raise the overlapping endportion of the second printed circuit board away from the end portion ofthe first printed circuit board and expose the end portion of the firstprinted circuit board; fixing the raised end portion of the secondprinted circuit board away from the exposed end portion of the firstprinted circuit board; pre-processing the exposed end portion of thefirst printed circuit board; and aligning a distal end of thepre-processed end portion of the first printed circuit board and adistal end of the end portion of the second printed circuit board.

Further, the end portions of the first and second printed circuit boardsmay be overlapped along an x-axis direction, said loading, on a stage, apanel assembly, may include disposing the overlapping end portions ofthe first and second printed circuit boards on a guide portion having aninclined surface inclined in the x-axis direction, and said providing ajet of air to the overlapping end portion of the second printed circuitboard may include jetting the air along the inclined surface of theguide portion, in the x-axis direction, to raise the end portion of thesecond printed circuit board and expose the end portion of the firstprinted circuit board.

Further, said fixing the raised end portion of the second printedcircuit board may include moving a fixing bar to support a lower surfaceof the raised end portion away from the exposed surface of the endportion of the first printed circuit board.

Further, said aligning distal ends of the first printed circuit boardand the second printed circuit board may include interposing a push pinbetween the end portions of the first printed circuit board and thesecond printed circuit board overlapping each other.

Further, said loading, on a stage, a panel assembly, may includedisposing the overlapping end portions of the first and second printedcircuit boards on a guide portion adjacent to the display panel in anx-axis direction, the end portion of the first printed circuit boardfixed to the guide portion, and said aligning distal ends of the firstprinted circuit board and the second printed circuit board may furtherinclude moving in the x-axis direction, the guide portion with the endportion of the first printed circuit board fixed thereto, the moving theguide portion in the x-axis direction moving the push pin away from theend portion of the second printed circuit board in a z-axis directioncrossing the x-axis direction, to move the end portion of the firstprinted circuit board away from the end portion of the second printedcircuit board in the z-axis direction.

Further, a moving distance of the push pin in the z-axis direction isequal to a moving distance of the guide portion in the x-axis direction.

Further, the method may further include with the distal ends of thefirst printed circuit board and the second printed circuit board alignedwith each other, electrically connecting the pre-processed end portionof the first printed circuit board to the overlapping end portion of thesecond printed circuit board.

Further, a portion of the display panel may be exposed from the firstand second printed circuit boards having the distal ends thereofaligned, and the method may further include irradiating a laser to theexposed portion of the display panel to perform marking of the displaypanel assembly.

Further, said pre-processing the exposed end portion of the firstprinted circuit board may include performing a plasma process or a fluxprocess on the exposed end portion of the first printed circuit board.

According to an embodiment of the present disclosure, there is provideda manufacturing apparatus of a display device, including: a stage onwhich a panel assembly is seated, the panel assembly including: adisplay panel which is drivable by a signal applied thereto to displayan image, and a first printed circuit board and a second printed circuitboard through which the signal is transmittable to the display panel,attached to the display panel, end portions of the first and secondprinted circuit boards disposed overlapping each other; a guiding memberdisposed adjacent to the stage, to which the end portion of the firstprinted circuit board is fixable; an air blower which is adjacent to theguiding member and provides a jet of air; and a fixing bar on which theend portion of the second printed circuit board is supportable spacedapart from the end portion of the first printed circuit board, thefixing bar disposed above the guiding member.

Further, the guiding member may include: a fixing portion to which theend portion of the first printed circuit board is fixable, and a guideportion along which the jet of air is guided from the air blower to theoverlapping end portions of the first and second printed circuit boards.

Further, the end portions of the first and second printed circuit boardsdisposed overlapping each other may extend from an end of the stage inan x-axis direction, and the fixing bar may have a length which extendsalong a y-axis direction crossing the x-axis direction, the fixing barbeing movable in the x-axis direction to support a lower surface of theend portion of the second printed circuit board spaced apart from theend portion of the first printed circuit board.

Further, the manufacturing apparatus may further include a push pindisposed between the overlapping end portions of the first printedcircuit board and the second printed circuit board.

Further, the end portions of the first and second printed circuit boardsdisposed overlapping each other may extend from an end of the stage inan x-axis direction, and movement in the x-axis direction of the guidingportion having the end portion of the first printed circuit board fixedthereto, may move the push pin away from the end portion of the secondprinted circuit board in a z-axis direction crossing the x-axisdirection to move the end portion of the first printed circuit boardaway from the end portion of the second printed circuit board in thez-axis direction.

Further, a moving distance of the push pin in the z-axis direction isequal to a moving distance of the guiding member in the x-axisdirection.

Further, distal ends of the end portions of the first and second printedcircuit boards disposed overlapping each other, may be aligned with eachother, and the first printed circuit board and the second printedcircuit board having the distal ends thereof aligned with each other maybe electrically connected to each other at the ends portions thereof.

Further, the end portion of the first printed circuit board fixed to theguiding portion may be movable relative to the end portion of the secondprinted circuit board to align the distal ends with each other.

Embodiments of the present disclosure provide at least the followingeffects.

By raising the printed circuit board away from an underlying printedcircuit board using air, damage to the printed circuit boards may beminimized.

By raising the printed circuit board away from an underlying printedcircuit board using air, damage to the printed circuit boards may bereduced or effectively prevented in a manufacturing process.

The effects of the present disclosure are not limited to theabove-described effects and other effects which are not described hereinwill become apparent to those skilled in the art from the followingdescription.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present disclosure will become moreapparent by describing in detail exemplary embodiments thereof withreference to the attached drawings, in which:

FIG. 1 is a block diagram showing an embodiment of a manufacturingmethod of a display device according to the invention;

FIG. 2 and FIG. 3 are top plan views of an embodiment of configurationsof a panel assembly used in a manufacturing method of a display deviceaccording to the invention;

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 3;

FIG. 5 is a partial perspective view of an embodiment of a manufacturingapparatus for manufacturing a display device according to the invention;

FIG. 6 and FIG. 7 are cross-sectional views taken along line II-II′ ofFIG. 5, illustrating an embodiment of processes in a method ofmanufacturing a display device using the manufacturing apparatusaccording to the invention

FIG. 8 is a partial cross-sectional view taken along line II-II′ of FIG.5, illustrating an embodiment of another process in a method ofmanufacturing a display device using the manufacturing apparatusaccording to the invention;

FIG. 9 and FIG. 10 are partial cross-sectional views taken along lineII-II′ of FIG. 5, illustrating an embodiment of still another process ina method of manufacturing a display device using the manufacturingapparatus according to the invention;

FIG. 11 is a partial cross-sectional view taken along line II-II′ ofFIG. 5, illustrating an embodiment of yet another process in a method ofmanufacturing a display device using the manufacturing apparatusaccording to the invention; and

FIG. 12 and FIG. 13 are partial cross-sectional views taken along lineII-II′ of FIG. 5, illustrating an embodiment of yet another process in amethod of manufacturing a display device using the manufacturingapparatus according to the invention

DETAILED DESCRIPTION

The advantages and features of the invention and methods for achievingthe advantages and features will be apparent by referring to theembodiments to be described in detail with reference to the accompanyingdrawings. However, the invention is not limited to the embodimentsdisclosed hereinafter, but can be implemented in diverse forms. Thematters defined in the description, such as the detailed constructionand elements, are nothing but specific details provided to assist thoseof ordinary skill in the art in a comprehensive understanding of theinvention, and the invention is only defined within the scope of theappended claims.

Where an element is described as being related to another element suchas being “on” another element or “located on” a different layer or alayer, an element is located directly on another element or a layer oran element is located on another element via another layer or stillanother element. In contrast, where an element is described as being isrelated to another element such as being “directly on” another elementor “located directly on” a different layer or a layer, an element islocated on another element or a layer with no intervening element orlayer therebetween. In the entire description of the invention, the samedrawing reference numerals are used for the same elements across variousfigures.

Although the terms “first, second, and so forth” are used to describediverse constituent elements, such constituent elements are not limitedby the terms. The terms are used only to discriminate a constituentelement from other constituent elements. Accordingly, in the followingdescription, a first constituent element may be a second constituentelement.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “At least one” is not to be construed as limiting “a” or“an.” “Or” means “and/or.” As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.It will be further understood that the terms “comprises” and/or“comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, embodiments of the invention will be described withreference to the attached drawings.

FIG. 1 is a block diagram showing an embodiment of a manufacturingmethod of a display device according to the invention. Referring to FIG.1, a manufacturing method of a display device according to an embodimentof the present disclosure includes a first bending operation 51, aloading operation S2, a pre-processing operation S3, an aligningoperation S4, a pressing operation S5, a second bending operation S6 anda laser marking operation S7.

In an embodiment of a manufacturing method of a display device, thefirst bending operation 51 may be performed. The first bending operation51 may include deforming such as by bending a printed circuit board of apanel assembly of the display device, such as where the panel assemblyincludes at least two printed circuit boards.

Hereinafter, an embodiment of a panel assembly 1000 used in amanufacturing method for manufacturing a display device according to theinvention will be described with reference to the drawings. The panelassembly 1000 may be a sub-assembly of the finally formed displaydevice.

FIGS. 2 and 3 are top plan views of an embodiment of a configuration ofthe panel assembly 1000 used in the manufacturing method formanufacturing a display device according to the invention. FIG. 4 is across-sectional view taken along line I-I′ of FIG. 3.

Referring to FIGS. 2 to 4, in one embodiment, the panel assembly 1000includes a first panel PA1, a second panel PA2, a first printed circuitboard F1 and a second printed circuit board F2.

In one embodiment, the first panel PA1 and the second panel PA2 may besequentially stacked in a thickness direction of the display device.FIGS. 2 to 3 show the rear surface of the first panel PA1. As shown inFIG. 4, the second panel PA2 may be disposed below the first panel PA1.

In one embodiment, the first panel PA1 may be a display panel. The term“display panel” as used herein can be understood as a term collectivelyreferring to all kinds of display panels which generate and display animage under control of a driving/control signal applied thereto andusing light. In an embodiment, for example, the display panel may be adisplay panel of a liquid crystal display device or a display panel ofan organic light emitting display device.

In one embodiment, the display panel may be a flexible display havingflexibility.

In one embodiment, the second panel PA2 may include an input detectionunit (not shown). That is, the second panel PA2 may include componentswhich function to detect a stimulus provided from outside thereof and/oroutside the display device, and generate a specific signal in responseto the stimulus.

In one embodiment, the second panel PA2 may be a touch screen panel(TSP).

FIG. 4 shows a case where the first panel PA1 is disposed on (e.g.,above) the second panel PA2, but the stacking order is not limitedthereto. That is, in another embodiment, the second panel PA2 may bestacked on (e.g., above) the first panel PA1.

Although not shown in FIG. 4, a window may be disposed below the secondpanel PA2. That is, in one embodiment, the panel assembly 1000 mayinclude a window which defines an outer surface thereof. The displayedimage may be visible through the window, such as at a viewing side ofthe display device.

FIGS. 2 and 3 show the rear surface of the first panel PA1. That is, thefront surface of the first panel PA1 is in contact with the second panelPA2, and the rear surface of the first panel PA1 is as shown in FIG. 2or 3. In the top plan view, the first panel PA1 (or the second panelPA2) may have an overall shape defining plural sides thereof connectedto each other, to form the overall shape.

In one embodiment, the first printed circuit board F1 may be disposed ata first side 21 of the panel assembly 1000. The first printed circuitboard F1 may be electrically connected to the first panel PA1. In otherwords, the first printed circuit board F1 may receive and/or transmit asignal required for driving the first panel PA1, to the first panel PA1,via the connection therebetween.

In one embodiment, the first printed circuit board F1 may include afirst connection portion 110, a first attachment portion 120 and a firstcircuit portion 130.

The first connection portion 110 may be electrically connected to asecond connection portion 210, which will be described later. In oneembodiment, a plurality of connection pads (not shown) may be disposedin the first connection portion 110, such as on a base substrate of thefirst printed circuit board F1. In addition, in one embodiment, apre-bonding portion 71 (shown in FIG. 5) may be disposed at the firstconnection portion 110, such as on the base substrate of the printedcircuit board F1.

The pre-bonding portion 71 may bond the first connecting portion 110 andthe second connecting portion 210 to each other, in a pre-pressingoperation to be described later. To this end, the pre-bonding portion 71may include a thermal sensitive adhesive (“TSA”).

The first attachment portion 120 may be attached to the first panel PA1.Accordingly, the first attachment portion 120 can electrically connectthe first printed circuit board F1 to the first panel PA1.

The first circuit portion 130 may extend from the first attachmentportion 120. With the first attachment portion 120 on the first panelPA1, the first printed circuit board F1 may extend further from edges ofthe first panel PA1 such as at the first circuit portion 130 thereof. Aplurality of circuit patterns may be disposed or formed at the firstcircuit portion 130, such as on the base substrate of the first printedcircuit board F1. The plurality of circuit patterns serve to transmitsignals therethrough, and thus can transmit signals to and/or from thefirst panel PA1.

The second printed circuit board F2 may be disposed at a second side 22of the panel assembly 1000. In one embodiment, the second side 22 may bea side portion extending from one end of the first side 21. The secondprinted circuit board F2 may be electrically connected to the secondpanel PA2. In other words, the second printed circuit board F2 mayreceive and/or transmit a signal required for driving the second panelPA2, to the second panel PA2, via the connection therebetween.

In one embodiment, the second printed circuit board F2 may include asecond connection portion 210, a second attachment portion 220 and asecond circuit portion 230.

In one embodiment, the second connection portion 210 may include aplurality of connection pads, such as on a base substrate of the secondprinted circuit board F2. The second connection portion 210 of thesecond printed circuit board F2 may be bonded to the first connectionportion 110 of the first printed circuit board F1, in a pressingoperation to be described later.

The second attachment portion 220 may be attached to the second panelPA2. Accordingly, the second attachment portion 220 can electricallyconnect the second printed circuit board F2 to the second panel PA2.

The second circuit portion 230 may extend from the second attachmentportion 220. With the second attachment portion 220 on the second panelPA2, the second printed circuit board F2 may extend further from edgesof the second panel PA2 such as at the second circuit portion 230thereof. A plurality of circuit patterns may be disposed or formed onthe second circuit portion 230, such as on the base substrate of thesecond printed circuit board F2. The plurality of circuit patterns serveto transmit signals, and thus can transmit signals to and/or from thesecond panel PA2.

An embodiment of a manufacturing apparatus for manufacturing a displaydevice according to the invention may further include a marking portion55. The marking portion 55 may be disposed on the rear surface of thefirst panel PA1. It is possible to mark necessary information in themarking portion 55 by irradiating a laser in the laser marking operationS7 to be described later. This will be described in detail later.

The first bending operation S1 will be described with reference to FIG.3 taken with FIG. 2.

The first bending operation S1 may include bending the first printedcircuit board F1 and/or the second printed circuit board F2, such asfrom an initial position thereof shown in FIG. 2.

The first printed circuit board F1 and the second printed circuit boardF2 have flexibility and can be deformed or bent accordingly.

In one embodiment, the first printed circuit board F1 may be bent alonga first bending line BL1 parallel to a y-axis, and the second printedcircuit board F2 may be bent along a second bending line BL2 parallel toan x-axis crossing the y-axis. The bending lines may correspond or bealigned with a side of the first panel PA1, without being limitedthereto. The bending lines may respectively define bending axes aboutwhich a printed circuit board is deformed such as by bending thereof.

The overall display device and/or components thereof, may be disposed ina plane defined by first and second directions (e.g., the x-axis and they-axis). A thickness direction of the overall display device and/orcomponents thereof extends in a third direction (e.g., z-axis direction)crossing each of the first and second directions. The first to thirddirections may be perpendicular to each other, without being limitedthereto.

Further, the first printed circuit board F1 and the second printedcircuit board F2, portions of which are disposed on the front surface ofthe first panel PA1 (shown by dotted lines in FIGS. 2 and 3), may bebent along the bending lines described above, toward the rear surface ofthe first panel PA1 to dispose other portions thereof on the rearsurface as shown in FIG. 4. Accordingly, at least a portion of the firstcircuit portion 130 and at least a portion of the second circuit portion230 may be disposed on the rear surface of the first panel PA1. Moreparticularly, among portions of a printed circuit board which extendfurther than an edge of a panel, a first portion may be disposed on therear surface of the panel while a second portion thereof may connect thefirst portion to a remaining portion of the printed circuit board at thefront surface of the panel.

Further, when the first printed circuit board F1 and the second printedcircuit board F2 are bent along the first bending line BL1 and thesecond bending line BL2 respectively, the first connection portion 110and the second connection portion 120 may be disposed outside the firstpanel PA1 as illustrated in FIG. 3. That is, distal ends of the firstand second printed circuit boards F1 and F2 at the first connectionportion 110 and the second connection portion 120 extend further than anedge of the first panel PA1, such as further than a same edge (e.g.,first side 21). Also, the first connection portion 110 and the secondconnection portion 120 may at least partially overlap each other. Thatis, as shown in FIG. 4, the first printed circuit board F1 and thesecond printed circuit board F2 may at least partially overlap eachother in a cross-sectional view. A distal end portion of the firstprinted circuit board F1 may be covered (e.g., overlapped) by a distalend portion of the second printed circuit board F2.

Subsequently, referring to FIG. 5, after the first bending operation S1,the loading operation S2 and the pre-processing operation S3 may beperformed. The loading operation S2 and the pre-processing operation S3may be performed by one or more embodiment of a manufacturing apparatusfor manufacturing a display device according to the invention.

FIG. 5 is a partial perspective view of an embodiment of a manufacturingapparatus for manufacturing a display device according to the invention.FIGS. 6 and 7 are cross-sectional views taken along line II-II′ of FIG.5 illustrating an embodiment of a process in a method of manufacturing adisplay device using the manufacturing apparatus according to theinvention.

Referring to FIGS. 5 to 7, in one embodiment, a manufacturing apparatusof a display device may include a stage ST, an air blower 500, a backup(support) 600 and a fixing bar 95.

The stage ST can support the panel assembly 1000 having the bent printedcircuit boards, thereon. The stage ST may provide a space or planar area(e.g., in the x-axis and y-axis plane) in which the panel assembly 1000is seated. In one embodiment, the stage ST may fix the panel assembly1000 relative to a portion of the manufacturing apparatus, such as at aspecific location within the space or planar area. The manner in whichthe stage ST fixes the panel assembly 1000 is not limited. In anembodiment, for example, the stage ST may fix the panel assembly 1000 ina location on the stage ST, by a vacuum suction method. In this case, aplurality of suction holes (not shown) may be disposed at the stage STto apply a holding force to the panel assembly 1000.

Similar to the panel assembly 1000, the stage ST may have an overallshape defining plural sides thereof connected to each other, to form theoverall shape. The backup 600 may be disposed at one side of the stageST. The backup 600 may fix the second connection portion 210 at alocation relative to a portion of the manufacturing apparatus. Thesecond connection portion 210 which extends further than the edge of thefirst panel PA1 corresponds to the backup 600 which is extended furtherthan an edge of the stage ST.

In one embodiment, the backup 600 may include a guide portion 81, and afixing portion 82 for fixing the first connection portion 110. Thefixing portion 82 may support the first and second connection portions110 and 210 overlapping each other

The fixing portion 82 may fix the first connection portion 110. In oneembodiment, the fixing portion 82 may fix the first connection portion110 by a vacuum suction method. To this end, a vacuum suction pad (notshown) may be disposed on the fixing portion 82 to apply a holding forceto the first connection portion 110.

The guide portion 81 may be disposed at one side or at the distal end ofthe fixing portion 82. The guide portion 81 includes an inclined surfacewhich has a length extending in an x-axis direction and the length risesin a z-axis direction. The guide portion 81 may serve to guide airprovided from the air blower 500, which will be described later.

The inclined surface included in the guide portion 81 may be a curvedsurface or a flat surface. When the guide portion 81 includes a curvedsurface, the curved surface may have a certain curvature.

In one embodiment, the backup 600 may move in one direction selectedfrom the x, y and z axes. Accordingly, the backup 600 can adjust theposition of the first connection portion 110 supported thereon, in thealigning operation S4 to be described later.

The air blower 500 may be disposed at one side of the backup 600. Theair blower 500 may include at least one nozzle through which air isexpelled. FIG. 5 shows a case in which the air blower 500 includes afirst nozzle A1.

The first nozzle Al may face the guide portion 81 of the backup 600.Also, the first nozzle A1 extends in the x-axis direction, so that theair provided from the first nozzle Al can travel in the x-axisdirection. The air provided from the first nozzle Al may be guided andraised by the guide portion 81. Accordingly, the air may raise thesecond connection portion 210 in the z-axis direction (see FIG. 6).

The fixing bar 95 may be disposed above the backup 600. The fixing barmay have a length which extends in the y-axis direction. The fixing bar95 may move in the x-axis direction. The fixing bar 95 may support alower surface of the second printed circuit board F2 which is tilted bythe air, so that the second printed circuit board F2 can be held in atilted state (see FIG. 7).

Hereinafter, the loading operation S2 and the pre-processing operationS3 using an embodiment of a manufacturing apparatus for manufacturing adisplay device according to the invention will be described.

In one embodiment, with the panel assembly 1000 having the bent printedcircuit boards on the stage ST and the first connection portion 110 heldfixed at the fixing portion 82, the loading operation S2 may includeraising the second connection portion 210 from the fixed firstconnection portion 110 overlapped thereby. The raising of the secondportion away from the first connection portion 110 may be performed byproviding air to the second connection portion 210 of the panel assembly1000 seated on the stage ST, and supporting the raised second connectionportion 210 using the fixing bar 95. The air may be provided to aninterface of the first and second connection portions 110 and 210, toseparate and raise the second connection portion 210 from the firstconnection portion 110.

The operation of raising the second connection portion 210 by jettingair toward the guide portion 81 by the first nozzle Al may be performed.The air provided from the first nozzle Al may be directed toward theguide portion 81, and a path of the air may be guided and raised by theinclined surface included in the guide portion 81 toward the secondconnection portion 210. The rising air may be provided to the lowersurface of the second connection portion 210, at the interface with thefirst connection portion 110, to raise the second connection portion 210(see FIG. 6).

The operation of moving the fixing bar 95 toward the raised secondconnection portion 210 may be performed. The fixing bar 95 moves in thex-axis direction to support the raised second connection portion 210, sothat the second printed circuit board F2 can be fixed in a tilted state(see FIG. 7). The first connection portion 110 remains in a flat (e.g.,planar) state as being fixed to the fixing portion 82, while the secondconnection portion 210 is raised to be separated from the firstconnection portion 110.

Then, referring to FIG. 8, the pre-processing operation S3 may beperformed.

FIG. 8 is a partial cross-sectional view taken along line II-II′ of FIG.5, illustrating an embodiment of another process in a method ofmanufacturing a display device using the manufacturing apparatusaccording to the invention.

The pre-processing operation S3 may be performed in a state in which aportion of the second printed circuit board F2 (e.g., the secondconnection portion 210) is tilted.

In one embodiment, an exemplary embodiment of a manufacturing apparatusof a display device may further include a first pre-processing device410 and/or a second pre-processing device 420.

The pre-processing operation S3 may be performed by the firstpre-processing device 410 and/or the second pre-processing device 420.

While the second connection portion 210 is raised to be separated fromthe first connection portion 110, a surface of the first connection isexposed from the second connection portion 210. A pre-processingoperation may be performed on the exposed portion of the firstconnection portion 110. In one embodiment, the first pre-processingdevice 410 may perform a plasma process on the surface of the firstconnection portion 110 exposed from the previously overlapping secondconnection portion 220. In addition, in one embodiment, the secondpre-processing device 420 may perform a flux process on the surface ofthe first connection portion 110.

In one embodiment, the plasma process by the first pre-processing device410 and the flux process by the second pre-processing device 420 may beoptional. However, the present disclosure is not limited thereto. Inanother embodiment, the plasma process by the first pre-processingdevice 410 and the flux process by the second pre-processing device 420may be performed sequentially or simultaneously.

FIGS. 9 and 10 are partial cross-sectional views taken along line II-II′of FIG. 5, illustrating an embodiment of still another process in amethod of manufacturing a display device using the manufacturingapparatus according to the invention.

Referring to FIGS. 9 and 10, the aligning operation S4 may be performed.In one embodiment, an embodiment of a manufacturing apparatus formanufacturing a display device may further include a push pin 96. Thepush pin 96 may have a bar shape with a length thereof extending in they-axis direction.

The push pin 96 may be interposed between the first printed circuitboard F1 and the second printed circuit board F2. That is, in themanufacturing method, the aligning operation S4 may include disposingthe push pin 96 between the first printed circuit board F1 and thesecond printed circuit board F2. In an embodiment, the push pin 96 maydisposed between the first printed circuit board F1 and the secondprinted circuit board F2 while the fixing bar 95 holds the secondconnection portion 210 raised to be separated from the first connectionportion 110. Once the push pin 96 is disposed between the first printedcircuit board F1 and the second printed circuit board F2, the fixing bar95 may be removed while the push pin 96 remains between the firstprinted circuit board F1 and the second printed circuit board F2.

After the push pin 96 is interposed between the first printed circuitboard F1 and the second printed circuit board F2, the backup 600 maymove in the x-axis direction while fixing the first connection portion110. In this case, the distal end of the first connection portion 110may move in the x-axis direction as the backup 600 moves (see FIG. 10).With the first printed circuit board F1 fixed to the first panel PA1,the moving of the distal end of the first connection portion 110 mayshorten an initial length of the first connection portion 110 and form arecess at the push pin 96 as shown in FIG. 10. While the distal end ofthe first connection portion 110 moves in the x-axis direction, thedistal end of the second printed circuit board F2 remains stationarysuch that the first printed circuit board F1 moves relative to thesecond printed circuit board F2.

Thus, the distal end of the first connection portion 110 and the distalend of the second connection portion 210 may be aligned with each other.FIG. 10 shows a case where the distal end of the first connectionportion 110 and the distal end of the second connection portion 210 arealigned.

The push pin 96 may press the first connection portion 110 to reduce thelength of the first connection portion 110 in the x-axis direction. Thatis, the push pin 96 may press the first connection portion 110 whilemoving in the z-axis direction in a state of being in contact with thefirst connection portion 110. The pressing of the push pin 96 forms therecess in the first connection portion 110.

In one embodiment, the push pin 96 may move in conjunction with thebackup 600. That is, the push pin 600 may move in proportion to theamount of movement of the backup 600.

In other words, although the backup 600 moves in the x-axis directionand the push pin 96 moves in the z-axis direction, the movement amountsmay be proportional to each other.

In one embodiment, the movement amount of the backup 600 may be the sameas the movement amount of the push pin 96. That is, a first distance dlin the x-axis direction, which is a moving distance of the backup 600,may be substantially the same as a second distance d2 in the z-axisdirection, which is a moving distance of the push pin 96.

In one embodiment, interlocking of the backup 600 and the push pin 96may utilize a cam structure (not shown). That is, when the backup 600moves in the x-axis direction, a driving force whose direction ischanged by the cam structure may move the push pin 96 in the z-axisdirection. Accordingly, the movement amounts of the backup 600 and thepush pin 96 may be proportional to each other while being in differentdirections from each other. In the aligning operation S4, the first andsecond connection portions 110 and 210 may not be fixed to each other.

As described above, when the backup 600 and the push pin 96 interlockwith each other and the push pin 96 pushes down the first connectionportion 110, the tension of the first connection portion 110 can be keptconstant. When the backup 600 is moved in a conventional aligningoperation, a part of the first connection portion 110 may rise up due toa tension applied to the first connection portion 110. Alternatively,the first connection portion 110 may be detached from the backup 600 orcause damage to the second connection portion 210 by applying a force tothe backup 600. As described above, in one or more embodiment of thealigning operation S4, when the first connection portion 110 is presseddownward and the tension is kept constant, damage to the secondconnection portion 210 by the first connection portion 110 or detachmentthereof from the backup 600 may be reduced or effectively prevented.

FIG. 11 is a partial cross-sectional view taken along line II-II′ ofFIG. 5, illustrating an embodiment of yet another process in a method ofmanufacturing a display device using the manufacturing apparatusaccording to the invention.

Referring to FIG. 11, the pressing operation S5 for pressing the firstconnection portion 110 and the second connection portion 210 to eachother may be performed.

In one embodiment, the pressing operation S5 may include a pre-pressingoperation and a main pressing operation. The pre-pressing operation mayuse the pre-bonding portion 71 disposed on the first connection portion110 (see FIG. 5). That is, the first connection portion 110 and thesecond connection portion 210 may be bonded to each other after thepre-bonding portion 71 disposed on the first connection portion 110 ispartially melted. The pre-bonding portion may be partially melted withthe distal ends of the first and second connection portions 110 and 210aligned with each other, without being limited thereto.

That is, the first connection portion 110 and the second connectionportion 210 may be bonded to each other using the TSA of the pre-bondingportion 71 disposed on the first connection portion 110.

After the pre-pressing operation to partially melt the pre-bondingportion 71 such as by applying heat thereto, the main pressing operationmay be performed.

An embodiment of a manufacturing apparatus of a display device accordingto the invention may further include a pressing (member) portion 800.The main pressing operation may be performed by the pressing portion800. That is, the first connection portion 110 and the second connectionportion 210 are bonded to each other by allowing the pressing portion800 to press the first connection portion 110 and the second connectionportion 210 in the pre-pressed state. By pressing the first connectionportion 110 and the second connection portion 210 in the pre-pressedstate (e.g., the partially melted pre-bonding portion 71), the firstconnection portion 110 and the second connection portion 210 may beelectrically connected to each other by the main pressing operation.

Once the first connection portion 110 and the second connection portion210 are pressed in the main pressing operation, the pressing portion 800may be removed to leave the distal end portions of the first connectionportion 110 and the second connection portion 210 extended further thanthe edge of the first display panel P1 and overlapping each other.

Additionally, the push pin 96 may be removed from between the firstconnection portion 110 and the second connection portion 210. Since thedistal ends of first connection portion 110 and the second connectionportion 210 are fixed to each other at the backup 600 and the ends ofthe first connection portion 110 and the second connection portion 210opposite to the distal ends are fixed to the first panel PA1, the pushpin 96 may be removed from between the first connection portion 110 andthe second connection portion 210.

The second bending operation S6 and the laser marking operation S7 willbe described with reference to FIGS. 12 and 13.

FIGS. 12 and 13 are partial cross-sectional views taken along lineII-II′ of FIG. 5, illustrating an embodiment of yet another process in amethod of manufacturing a display device using the manufacturingapparatus according to the invention.

Referring to FIG. 12, the second bending operation S6 may be performed.The second bending operation S6 may include further bending the firstconnection portion 110 and the second connection portion 210 which arebonded to each other from the main pressing operation.

In the second bending operation S6, the first connection portion 110 andthe second connection portion 210 each extended further than the edge ofthe first display panel PA1 and overlapping each other may together bepositioned on the rear surface of the first panel PA1 by further bendingthe first connection portion 110 and the second connection portion 210in the x-axis direction (see FIG. 11 to FIG. 12). Accordingly, the firstconnection portion 110 and the second connection portion 210 disposednon-overlapping each other as being extended further than the firstpanel PA1, may overlap the first panel PA1 and the second panel PA2 bythe second bending operation S6.

Then, referring to FIG. 13, the laser marking operation S7 may beperformed. The laser marking operation S7 may include allowing a laserirradiating apparatus 900 to irradiate a laser to the marking portion 55(see FIG. 1) disposed on the rear surface of the first panel PA1. Themarking portion 55 of the rear surface of the first panel PA1 is exposedto outside thereof, such that the irradiated laser is incident thereto.

The laser provided from the laser irradiating apparatus 900 may disposeinformation regarding the panel assembly by the marking portion 55 onthe rear surface of the first panel PA1. The information displayed onthe marking portion 55 is not limited and may include letters ornumbers, such as those related to identifying or tracing the panelassembly. The panel assembly 1000 (see FIGS. 5 and 6) may be processedas described above, to complete manufacturing of the panel assembly 1000as a sub-component of a display device. The sub-component panel assembly1000 may be further processed and/or assembled with other components ofthe display device, to manufacture a complete display device.

Although the embodiments of the invention have been disclosed forillustrative purposes, those skilled in the art will appreciate thatvarious modifications, additions and substitutions are possible, withoutdeparting from the scope and spirit of the invention as disclosed in theaccompanying claims.

While the present invention has been particularly illustrated anddescribed with reference to exemplary embodiments thereof, it will beunderstood by those of ordinary skill in the art that various changes inform and detail may be made therein without departing from the spiritand scope of the present invention as defined by the following claims.The exemplary embodiments should be considered in a descriptive senseonly and not for purposes of limitation.

What is claimed is:
 1. A manufacturing method of a display device,comprising: loading, on a stage, a panel assembly including: a displaypanel which is drivable by a signal applied thereto to display an image,and a first printed circuit board and a second printed circuit boardthrough which the signal is transmittable to the display panel, attachedto the display panel, end portions of the first and second printedcircuit boards disposed overlapping each other; providing a jet of airto the overlapping end portion of the second printed circuit board toraise the overlapping end portion of the second printed circuit boardaway from the end portion of the first printed circuit board and exposethe end portion of the first printed circuit board; fixing the raisedend portion of the second printed circuit board away from the exposedend portion of the first printed circuit board; pre-processing theexposed end portion of the first printed circuit board; and aligning adistal end of the pre-processed end portion of the first printed circuitboard and a distal end of the end portion of the second printed circuitboard.
 2. The manufacturing method of claim 1, wherein the end portionsof the first and second printed circuit boards are overlapped along anx-axis direction, said loading, on a stage, a panel assembly, includesdisposing the overlapping end portions of the first and second printedcircuit boards on a guide portion having an inclined surface inclined inthe x-axis direction, and said providing a jet of air to the overlappingend portion of the second printed circuit board includes jetting the airalong the inclined surface of the guide portion, in the x-axisdirection, to raise the end portion of the second printed circuit boardand expose the end portion of the first printed circuit board.
 3. Themanufacturing method of claim 2, wherein said fixing the raised endportion of the second printed circuit board includes moving a fixing barto support a lower surface of the raised end portion away from theexposed surface of the end portion of the first printed circuit board.4. The manufacturing method of claim 1, wherein said aligning distalends of the first printed circuit board and the second printed circuitboard includes interposing a push pin between the end portions of thefirst printed circuit board and the second printed circuit boardoverlapping each other.
 5. The manufacturing method of claim 4, whereinsaid loading, on a stage, a panel assembly, includes disposing theoverlapping end portions of the first and second printed circuit boardson a guide portion adjacent to the display panel in an x-axis direction,the end portion of the first printed circuit board fixed to the guideportion, and said aligning distal ends of the first printed circuitboard and the second printed circuit board further includes moving inthe x-axis direction, the guide portion with the end portion of thefirst printed circuit board fixed thereto, the moving the guide portionin the x-axis direction moving the push pin away from the end portion ofthe second printed circuit board in a z-axis direction crossing thex-axis direction, to move the end portion of the first printed circuitboard away from the end portion of the second printed circuit board inthe z-axis direction.
 6. The manufacturing method of claim 5, wherein amoving distance of the push pin in the z-axis direction is equal to amoving distance of the guide portion in the x-axis direction.
 7. Themanufacturing method of claim 1, further comprising, with the distalends of the first printed circuit board and the second printed circuitboard aligned with each other, electrically connecting the pre-processedend portion of the first printed circuit board to the overlapping endportion of the second printed circuit board.
 8. The manufacturing methodof claim 1, wherein a portion of the display panel is exposed from thefirst and second printed circuit boards having the distal ends thereofaligned, further comprising irradiating a laser to the exposed portionof the display panel to perform marking of the display panel assembly.9. The manufacturing method of claim 1, wherein said pre-processing theexposed end portion of the first printed circuit board includesperforming a plasma process or a flux process on the exposed end portionof the first printed circuit board.